Company Profile
Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, 1.2V serial NOR, octal NOR, QspiNAND, OctalNAND, SLC NAND, NAND based MCP, SpiStack, and authentication flash products; TrustME secure flash memory, such as secure flash memory, and secure memory elements; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer fab production, testing, and foundry services; E-commerce and investment business; semiconductor component design and marketing services; smart factory solutions; semiconductor-related hardware and software system integration design; design, research, testing, sales, and service of integrated circuits and auxiliary equipment; develops automotive and industrial control software and services; customer service and technical support; computer software services; computers and peripherals, and software wholesale; repair, testing, and related technical consulting services; and rental of semiconductor-related equipment. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.
Latest News
| Sector | Technology |
| Industry | Semiconductors |
| Website | https://www.winbond.com |
| Audit Risk | 4 |
| Board Risk | 9 |
| Overall Risk | 8 |
| Market Cap | 720.00B |
| Trailing P/E | 47.48 |
| Forward P/E | 4.07 |
| Dividend Rate | 0.5 |
| Dividend Yield | 0.32% |
| Trailing Annual Div. Rate | 0.5 |
| Trailing Annual Div. Yield | 0.32% |
| Trailing EPS | 3.37 |
| Forward EPS | 39.31 |
| Book Value | 25.92 |
| Price-to-Book | 6.17 |
| Enterprise-to-Revenue | 6.87 |
| Enterprise-to-EBITDA | 23.88 |
| Ex-Dividend Date | 03/27/2026 |
| Earnings Date | 08/04/2026 |
| Earnings Call Date | 05/05/2026 |
| Earnings Average | 4.75 |
| Earnings Low | 3.67 |
| Earnings High | 6.14 |
| Revenue Average | 55.56B |
| Revenue Low | 48.26B |
| Revenue High | 62.13B |