Company Profile
KLA Corporation, together with its subsidiaries, designs, manufactures, and markets process control, process-enabling, and yield management solutions for the semiconductor and related electronics industries worldwide. The company operates through three segments: Semiconductor Process Control; Specialty Semiconductor Process; and PCB and Component Inspection. It offers inspection and review tools to identify, locate, characterize, review, and analyze defects on various surfaces of patterned and unpatterned wafers; metrology systems to measure pattern dimensions, film thickness, film stress, layer-to-layer alignment, pattern placement, surface topography, and electro-optical properties for wafers; chemical process control equipment; wired and wireless sensor wafers and reticles; wafer defect inspection, review, and metrology systems; reticle inspection and metrology systems; wafer inspection and metrology systems; and semiconductor software solutions that provide run-time process control, defect excursion identification, process corrections, and defect classification to accelerate yield learning rates and reduce production risk. The company also provides etch, plasma dicing, deposition, and other wafer processing technologies and solutions for the semiconductor and microelectronics industry. In addition, it offers direct imaging, inspection, optical shaping, inkjet and additive printing, and computer-aided manufacturing and engineering solutions for the PCB market and inspection and metrology systems for quality control and yield improvement in advanced and traditional semiconductor packaging markets. The company was formerly known as KLA-Tencor Corporation and changed its name to KLA Corporation in July 2019. KLA Corporation was incorporated in 1975 and is headquartered in Milpitas, California.
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Unveiling KLA (KLAC) Q4 Outlook: Wall Street Estimates for Key Metrics
| Sector | Technology |
| Industry | Semiconductor Equipment & Materials |
| Website | https://www.kla.com |
| Audit Risk | 3 |
| Board Risk | 3 |
| Overall Risk | 5 |
| Market Cap | 275.00B |
| Trailing P/E | 59.47 |
| Forward P/E | 41.03 |
| Dividend Rate | 0.92 |
| Dividend Yield | 0.44% |
| Trailing Annual Div. Rate | 0.76 |
| Trailing Annual Div. Yield | 0.35% |
| Trailing EPS | 3.54 |
| Forward EPS | 5.13 |
| Book Value | 4.46 |
| Price-to-Book | 47.19 |
| Enterprise-to-Revenue | 21.09 |
| Enterprise-to-EBITDA | 47.21 |
| Short Ratio | 1.82 |
| Ex-Dividend Date | 05/18/2026 |
| Dividend Date | 06/02/2026 |
| Earnings Date | 07/28/2026 |
| Earnings Call Date | 07/28/2026 |
| Earnings Average | 1 |
| Earnings Low | 0.99 |
| Earnings High | 1.03 |
| Revenue Average | 3.60B |
| Revenue Low | 3.57B |
| Revenue High | 3.67B |