Nexus Finance
002156.SZ TFME | CNE1000006C3

Company Profile

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices; and specific application integrated circuits that includes CPU, GPU, gaming console and high performance networking products. It serves communication, mobile terminals, household appliances, AI, auto electronics, and other sectors. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1994 and is headquartered in Nantong, China.

Latest News

Sector Technology
Industry Semiconductor Equipment & Materials
Website https://www.tfme.com
Audit Risk 8
Board Risk 6
Overall Risk 6
Market Cap 112.89B
Trailing P/E 78.31
Forward P/E 94.16
Dividend Rate 0.08
Dividend Yield 0.11%
Trailing Annual Div. Rate 0.08
Trailing Annual Div. Yield 0.11%
Trailing EPS 0.95
Forward EPS 0.79
Book Value 10.32
Price-to-Book 7.21
Enterprise-to-Revenue 4.54
Enterprise-to-EBITDA 24.86
Ex-Dividend Date 05/28/2026
Earnings Date
Earnings Call Date
Revenue Average 8.17B
Revenue Low 8.17B
Revenue High 8.17B
ende