002156.SZ
002156.SZ
CNE1000006C3
TFME
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Company Profile

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) encapsulation test services in China and internationally. The company offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband, memory devices, LCD driver devices, SiP devices, and power module devices; and specific application integrated circuits that includes CPU, GPU, gaming console and high performance networking products. It serves communication, mobile terminals, household appliances, AI, auto electronics, and other sectors. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1994 and is headquartered in Nantong, China.

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Key Metrics & Overview

Detailed metrics & financial data of the company

Company Profile
5 Metrics

🛡️ Risk & Structural Analysis

Multi-Factor Risk Model & Market Data

7/7 Very High
5Y Volatility
52.2% p.a.
Max Drawdown (5Y)
-42.2%
Sharpe Ratio (5Y)
0.40
Beta Factor
1.01
Size Class
Large Cap
Notes & Warnings
Single Stock Risk: Investing in an individual stock carries full company and insolvency risk (no fund diversification).
🔴 Low analyst coverage – higher uncertainty in growth estimates & projections
Structurally High Volatility: Above-average fluctuations persist across 5 to 10 years (52.2% p.a.).
Historical Stress Test: Maximum peak-to-trough drawdown of -62.2% in the extended horizon.
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